Techonology of Alps

We propose highly evolved devices with
advanced functions by fusing a wide range of core
and proprietary technologies.

Alps' System in Package Nano-Materials Nano-Machining MEMS Substrates Software (IC) Design/ Evaluation Materials Tooling / Processing JISSO / Assembly

Honing our monozukuri skills

A wealth of production and processing technologies has helped Alps deliver a continual stream of high-quality electronic devices. Advanced material design technology allows us to exceed our customers' performance requirements. Our molding technology helps ensure outstanding product reliability. And our Micro Electro-Mechanical Systems (MEMS) and JISSO technology make it possible to create high-precision devices and ultramicroscopic electronic circuits.
By continually refining and integrating the many distinct technologies we have accumulated over many years as an electronic components specialist, we look to create products that lead the industry in quality, innovation and performance.

Alps’ System in Package

Alps' System in Package blends together Alps Electric's core and proprietary technologies, including nano-processing, at a sophisticated level to develop highly functional devices. Guided by this development concept, we create human-machine interfaces that enable comfortable operation of appliances, machine-to-machine interfaces that enable seamless connection between devices, and advanced products for broadcasting and telecommunications fields.

Nano-Materials

Magnetic Material Powder Control
Nano-granular Magnetic Material
Organic Functional Film Material

Nano-Machining

Nanoimprint
Magnetic Ultra Thin-film Technology

MEMS

Processing Development of Fine Structure
Fabrication of Transcribed Mold with Fine Structure

Substrates

LTCC Substrate of Layer in Element
Feedthrough Electrode Formation on Glass
Electroless Cu Plating on The Mirror Surface
Ultra-fine Pitch Micro Contact

Software (IC)

High Speed Algorithm for Holographic Transformation
A Position Descrimination for Passive RKE
High-speed Thermal Transfer Printing
Algorithm for Electronic Compass

Design/ Evaluation

Design of Photonic Crystal
aF Order Capacitance Detection Circuit
Lighting Simulation
Magnetic Field Analysis Simulation

Materials

Thin Film Magnetic Material
Low Thermal Conductivity Glass Materials

Tooling / Processing

High-precision Press
40μmUltra-thin-walled Molding
High Accuracy Various Material Polishing

JISSO / Assembly

High-precision JISSO
Ultra-fine Pitch Micro Contact

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