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 > SSGM Series > SSGM780103
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｜Dimensions ｜Land Dimensions ｜Circuit Diagram ｜Packing Specifications ｜Soldering Conditions ｜

2 to 10 Circuits-designed Type SSGM Series

Detail

Part number SSGM780103

Soldering Reflow
Actuator configuration Flat
Operating force 3.5±2.5N
Packaging style Taping
Poles 8
Minimum order unit (pcs.) 2,000

Operating temperature range -40℃ to +85℃
Ratings (max.) (Resistive load) 25mA 24V DC (at opening and closing)
0.1A 50V DC (when energized)
50μA 3V DC
Electrical performance Contact resistance (Initial performance/After lifetime) 50mΩ max./100mΩ max.
Insulation resistance 100MΩ min. 500V DC
Voltage proof 500V AC for 1 minute
Mechanical performance Terminal strength 5N for 1 minute
Actuator strength Operating direction 10N
Pulling direction 10N
Resistance to soldering heat Manual soldering 350±5℃, 5s max.
Reflow soldering Refer to soldering conditions
Durability Operating life Without load 3,000 cycles
With load 3,000 cycles (25mA 24V DC)
Environmental performance Cold -40±2℃ for 250h
Dry heat 85±2℃ for 250h
Damp heat 40±2℃, 90 to 95%RH for 250h

Certificate of Compliance to RoHS regulations  

Dimensions

Dual-in-line Package Type Switch

Land Dimensions

Dual-in-line Package Type Switch

 
Viewed from direction A in the dimensions.

Circuit Diagram

Dual-in-line Package Type Switch


Packing Specifications

Taping

Number of packages (pcs.) 1 reel 1,000
1 case / Japan 1,000
1 case / export packing 2,000
Reel width W(mm) 45.4
Tape width (mm) 44
Export package measurements (mm) 406×406×190

Soldering Conditions

Example of Reflow Soldering Condition
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2Φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement.
3. Temperature profile
(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
A(℃)
3s max.		B(℃)C(℃)D(s)E(s)F(s)
240230150120--

Notes are common to this series/models.
  • This site catalog shows only outline specifications. When using the products, please obtain formal specifications for supply.
  • Please place purchase orders per minimum order unit (integer).
  • Products other than those listed in the above chart are also available. Please contact us for details.
  • This products can be used in vehicles.
    Although these products are designed to perform over a wide operating temperature range, please ensure that you receive and read the formal delivery specifications before use.
Inquiries about Products
For more information please contact: Products Information Center.
1-7, Yukigaya-otsukamachi, Ota-ku, Tokyo, 145-8501, Japan
Phone: +81 (3) 5499-8154
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