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 > SRBQ Series > SRBQ290301
Related information
｜Dimensions ｜Mounting Hole Dimensions ｜Circuit Diagram ｜Packing Specifications ｜
｜Soldering Conditions ｜

9-positions Low-profile Vertical Type SRBQ Series

Detail

Part number SRBQ290301

Poles 1
Positions 9
Changeover angle 40±3°
Changeover timing Non shorting
Rotational torque 6±3mN·m
Actuator configuration Non shaft
Soldering Reflow
Minimum order unit (pcs.) 4,800

Operating temperature range -10℃ to +60℃
Rating (max.)/(min.) (Resistive load) 0.1A 16V DC/50µA 3V DC
Electrical performance Contact resistance (Initial performance/After lifetime) 50mΩ max./100mΩ max.
Insulation resistance 100MΩ min. 100V DC
Voltage proof 100V AC for 1 minute
Mechanical performance Terminal strength 5N for 1 minute
Actuator strength Push direction 20N
Resistance to soldering heat Manual soldering 350±5℃, 3s max.
Reflow soldering Refer to soldering conditions
Durability Operating life without load 10,000 cycles 100mΩ max.
Operating life with load (Load: as ratings) 10,000 cycles 100mΩ max.
Environmental performance Cold -20±2℃ for 96h
Dry heat 85±2℃ for 96h
Damp heat 40±2℃, 90 to 95%RH for 96h

3D CAD (STEP)  
Certificate of Compliance to RoHS regulations  

Dimensions

Rotary Switch

Mounting Hole Dimensions

Rotary Switch

 
Viewed from direction A in the dimensions.

Circuit Diagram

Rotary Switch


Packing Specifications

Taping

Number of packages (pcs.) １ reel 1,200
1 case / Japan 2,400
1 case / export packing 4,800
Tape width (mm) 24
Export package measurements (mm) 406×406×190

Soldering Conditions

Example of Reflow Soldering Condition
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement.
3. Temperature profile
(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
A(℃)
3s max.		B(℃)C(℃)D(s)E(s)F(s)
240230150120--

Notes are common to this series/models.
  • This site catalog shows only outline specifications. When using the products, please obtain formal specifications for supply.
  • Please place purchase orders per minimum order unit (integer).
  • Products other than those listed in the above chart are also available. Please contact us for details.
Inquiries about Products
For more information please contact: Products Information Center.
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Phone: +81 (3) 5499-8154
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