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｜Photo ｜Dimensions ｜Land Dimensions ｜Circuit Diagram ｜Packing Specifications ｜
｜Soldering Conditions ｜

1.4(H)mm, 1.5/2.0mm-travel Surface Mount Type SSSS8 Series

Detail

Part number SSSS810701

Travel 1.5mm
Actuator directions Horizontal
Actuator thickness 1.1mm
Poles 1
Positions 2
Operating force Refer to the dimensions
Changeover timing Not specified
Ground terminal Without
Soldering Reflow
Minimum order unit (pcs.) 18,000

Operating temperature range -40℃ to +85℃
Rating (max.)/(min.) (Resistive load) 0.3A 5V DC/50µA 3V DC
Electrical performance Contact resistance
(Initial performance/After lifetime) 		70mΩ max./130mΩ max.
Insulation resistance 100MΩ min. 100V DC
Voltage proof 100V AC for 1 minute
Mechanical performance Terminal strength 3N for 1 minute
Actuator strength Operating direction 10N
Pulling direction 10N, Static force
Resistance to soldering heat Manual soldering 300±5℃,5s max.
Reflow soldering Refer to soldering conditions
Durability Operating life without load 10,000 cycles
100mΩ max.
Operating life with load
(Load: as ratings) 		10,000 cycles
130mΩ max.
Environmental performance Cold -40±2℃ for 96h
Dry heat 85±2℃ for 96h
Damp heat 40±2℃, 90 to 95%RH for 96h

3D CAD (STEP)  
Certificate of Compliance to RoHS regulations  

Photo

Slide Switch

Dimensions

Slide Switch

 
Products not marked with * in the drawing have no ground terminal.

Land Dimensions

Slide Switch

 
Viewed from direction A in the dimensions.

Circuit Diagram

Slide Switch


Packing Specifications

Taping

Number of packages (pcs.) 1 reel 4,500
1 case / Japan 9,000
1 case / export packing 18,000
Reel width W(mm) 17.4
Tape width (mm) 16
Export package measurements (mm) 417×409×139

Soldering Conditions

Example of Reflow Soldering Condition (Reference)
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement.
3. Temperature profile
(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
(3) Ask us for the specifications of lead-free products.
A(℃)
3s max.		B(℃)C(℃)D(s)E(s)F(s)
255200150120--

Notes are common to this series/models.
  • This site catalog shows only outline specifications. When using the products, please obtain formal specifications for supply.
  • Please place purchase orders per minimum order unit (integer).
  • Products other than those listed in the above chart are also available. Please contact us for details.
  • This products can be used in vehicles.
    Although these products are designed to perform over a wide operating temperature range, please ensure that you receive and read the formal delivery specifications before use.
Inquiries about Products
For more information please contact: Products Information Center.
1-7, Yukigaya-otsukamachi, Ota-ku, Tokyo, 145-8501, Japan
Phone: +81 (3) 5499-8154
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