Example of Reflow Soldering Condition
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Double heating method with infrared heater.
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2. Temperature measurement
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Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement.
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A(℃) 3s max. | B(℃) | C(s) | D(℃) | E(℃) | F(s) | 260 | 230 | 40 | 180 | 150 | 120 |
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(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
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(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
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Reference for Hand Soldering
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Soldering temperature | 330±5℃ | Soldering time | 3s max. |
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